Choose "Micro Cooling Fan" fins, the easiest way is to use the concept of resistance to the design, the thermal resistance of electronic thermal management technology is an important design parameter, is defined as: R = ΔT / P
Wherein ΔT is the temperature difference, P is the heat consumption of the chip. Thermal heat transfer device representative of the degree of difficulty, the greater the resistance, the cooling effect of the device was worse, if resistance is smaller, the representatives of "Micro cooling Fan" cooling devices more easily. IC packaging will make chips generated after the installation of the heatsink heat up through most of the heat transfer fins, resistance posed by the network's point of view, and it includes the heat from the chip to the package by a shell of thermal Rjc, "Micro cooling Fan "heat from the package surface to the bottom of the heat sink thermal resistance Rcs via the interface material to the bottom of the heat sink and the heat from the bottom of the heat sink thermal resistance of the atmosphere reached Rsa three parts.